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Research Thrusts |
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Engineering Education Innovation
As the world continues to change with globalization and technological advances so must engineering education p...
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Advanced Power System
In the face of an impending energy crisis, the Advanced Power Systems research center is exploring alternative...
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Space Systems
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Mechanics of Multi-scale Materials
The Mechanics of Multi-scale Materials research group uncovers the relationships of structures across the full...
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Multi-scale Sensors and Systems
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Sustainable Manufacturing and Design
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Research Projects
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Mechanics of Multilayered Ceramic Thin Films |
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Project Date:
08/2008-08/2010 |
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Spandan Maiti
Primary Investigator
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Ghatu Subhash, University Florida
Co-Primary Investigator
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Sponsor:
National Science Foundation
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Ceramic nanofilms are finding increasing use in many advanced and emerging technologies such as integrated electronic circuits for charge storage, surface coatings and thermal barriers to protect structural components, and as parts for MEMS devices. For improved performance and operational reliability of systems and devices incorporating nanofilms, it is necessary to evaluate their mechanical properties and failure behavior. Objectives for this research are experimental characterization of multilayer films, identification of physical phenomena responsible for deformation and failure behavior of these materials, and development of scale bridging computational techniques to simulate and predict the mechanical response of this class of materials at different length scales.
The accomplishment of my research group so far is
* Development of a scale bridging framework to simulate thin film response in continuum scale incorporating nanoscale phenomena;
* Incorporation of interfacial debonding and microcracking of the films.
Research is under way to further develop the computational model to include
* Dislocation dynamics in thin films to quantify creeping;
* Creep and diffusion assisted nucleation and growth of voids;
* Damage accumulation and attendant failure due to void growth, debonding, and microcracking.
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